Vector Informatik GmbH and SCSK Corp. have developed a joint evaluation bundle for embedded sensor and actuator applications based on Renesas RL78/F2x microcontrollers (MCUs). The package combines Vector’s MICROSAR IO with SCSK’s QINeS-Lite software platform and device drivers, providing a pre-integrated software foundation intended to reduce initial setup and integration work during application development and evaluation. MICROSAR IO is designed for sensor and actuator applications running on MCUs with limited hardware resources. Its lightweight architecture is intended to reduce software complexity and development effort while providing the basic software functions required for embedded I/O applications.

Aetina Corp. has introduced its DeviceEdge AIE-KT78 and AIE-KT68 flagship edge AI systems for robotics and autonomous machines. The edge AI systems, powered by Nvidia Jetson Thor, integrate the Nvidia Blackwell architecture’s high-performance AI compute, high-bandwidth sensor connectivity, and deterministic industrial control. These edge systems help developers design collaborative robots (cobots), humanoid robots, and autonomous machines that “perceive, reason, decide, and act” in real-world environments. The AIE-KT78 and AIE-KT68 edge AI systems support on-device multimodal generative AI, large language models (LLM), vision language models (VLM), and vision language action (VLA) model execution.

Efinix Inc. has introduced the Sapphire RV64 SoC, a 64-bit RISC-V processor core designed to extend the company’s embedded processing capabilities beyond its existing 32-bit Sapphire RV32 architecture. The new SoC targets FPGA-based applications that need greater processing performance, larger addressable memory, expanded I/O, and Linux support, while retaining the configurability and low-power characteristics of an FPGA implementation. Sapphire RV64 implements the RISC-V64IM instruction set with a seven-stage pipeline and optional A, F, D, C, Zba, Zbb, Zbs, and Zicbom extensions. The processor supports between 4 and 512 KB of on-chip RAM and incorporates a multi-way L1 instruction and data cache.

The device rebooted and the evidence disappeared. Now what?

MathWorks has released MATLAB and Simulink Release 2026b (R2026b), introducing new products and enhancements for engineering teams developing increasingly complex systems that combine software, electronics, and artificial intelligence. The release expands capabilities for system configuration, simulation, verification, visual inspection, perception, embedded software, aerospace, and data analysis, aiming to streamline workflows from design and modeling through deployment. One of the main additions is Simulink Variant Manager, which provides tools for managing multiple product variants within complex models and system architectures. The capability is designed to improve consistency, traceability, and collaboration when developing product families and platform-based systems.

Making the right security choices for the EU Cyber Resilience Act and why this matters now.

The EU CRA is changing what secure-by-design means for embedded developers.

Leopard Imaging and Lumotive have introduced Sirius Max, a long-range, software-defined 3D perception platform designed for robotics, industrial automation, autonomous machines, automotive systems, and edge AI applications. The LI-AR0234-AF0130-TX10-GMSL2-140H combines RGB imaging, intelligent indirect time-of-flight (iToF) depth sensing, embedded processing, synchronization, and programmable beam-steered illumination in a compact GMSL2 camera module. Sirius Max uses Lumotive’s programmable beam-steering technology to dynamically control illumination and depth scanning. Unlike conventional time-of-flight systems based on flood illumination, the architecture directs optical energy toward selected areas of the scene. According to the companies, this approach improves optical efficiency, ambient-light rejection, signal-to-noise ratio, and long-range sensing performance while maintaining a solid-state architecture without moving mechanical components.

Here’s a roundup of this week’s must-read articles. We'll cover the latest developments on the hidden cost of embedded databases on NAND flash memory, security in SDVs, choosing a cross-platform IDE for embedded SW development, and a lot more. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Synopsys, TSMC Advance Agentic AI for Chip Design The new design flows cover the A14 process, agentic AI, CoWoS IVR design, co-packaged optics, and 2-nm IP for next-generation AI and HPC systems.

Ezurio has launched the BL54LM20 Series of Bluetooth LE modules. The new family includes the BL54LM20A with Bluetooth LE Core 6.x, 802.15.4 (Thread/Matter), and NFC; the BL54LM20B with Bluetooth LE, 802.15.4, NFC, and an edge AI neural processing unit (NPU); and the BL54LM20B USB-C adapter for Bluetooth LE and 802.15.4 connectivity. The BL54LM20 Series, built on Nordic Semiconductor’s new nRF54LM20A and nRF54LM20B SoCs, delivers USB and for the first time module-level edge AI capability in the BL54L family. The new modules, combining a 128-MHz Arm Cortex-M33 application processor with a 128-MHz RISC-V coprocessor, also feature more memory with 2 MB of non-volatile memory and 512 KB RAM, providing more headroom for larger applications, according to the company.

EdgeCortix Inc. has introduced RAIDEN, a scalable AI chiplet platform designed for energy-efficient physical AI applications deployed outside centralized data centers. The architecture combines compute, memory, bandwidth, connectivity, and software within a common platform that scales from a single compute die to a four-die configuration. The flagship RAIDEN-X4 delivers up to 3.36 PFLOPS of FP4 AI compute, 256 GB of memory, 548 GB/s of memory bandwidth, and up to 1.54 TB/s of aggregate die-to-die bandwidth. The RAIDEN family comprises single-die X1, two-die X2, and four-die X4 configurations. All variants use EdgeCortix’s DNA-X accelerator architecture and MERA software stack, allowing compute and memory resources to scale while maintaining a common software environment.

SDVs expand the attack surface with continuously updated software across centralized compute and always-on connectivity, requiring a rethink in security architecture.

Synopsys and TSMC are expanding their collaboration to accelerate the development of AI, high-performance computing (HPC), and other advanced semiconductor systems. The latest work combines certified EDA flows for TSMC’s A14 process, agentic AI-assisted engineering workflows, multi-die design capabilities for CoWoS packaging, multiphysics-aware signoff, and an expanding portfolio of silicon-proven interface and foundation IP. For advanced-node adoption, Synopsys and TSMC have achieved certification of digital and analog design flows for A14, providing a methodology covering implementation through signoff. The companies are also working on device-routing enablement for A14 in analog design, targeting automated place-and-route capabilities intended to improve layout productivity and facilitate migration to advanced process technologies.

A simulated robotics workload shows how RaiderChip schedules language and control models on a single GenAI NPU.

Windows-only embedded toolchains cost teams in hiring, re-qualification, and debugging time. See how a certified cross-platform IDE truly closes that gap.

Cadence Design Systems Inc. has expanded its ChipStack AI Super Agent with a new RTL Generation Agent that automates front-end digital design tasks, from high-level specifications to RTL generation, analysis, and refinement. The agent uses established electronic design automation (EDA) technologies to optimize power, performance, and area (PPA) while also supporting verification and design updates through natural-language prompts. The new capability extends ChipStack beyond autonomous verification and debugging into RTL creation and optimization. According to Cadence, early evaluations showed an average 24% reduction in area and 18% reduction in power compared with RTL generated directly by foundation models, while maintaining functional accuracy.

This panel brings together industry experts to discuss how real-world applications are reshaping embedded architectures, from EVs and industrial automation to wearables and the smart grid.

MediaTek has unveiled the Dimensity CX C10 Max system-on-chip (SoC), the first chip in the company’s new Dimensity Compute Experiences (CX) family. The flagship CX chip delivers high performance, advanced functionality, and higher power efficiency for an upcoming premium, ultra-portable Googlebook device. The Dimensity CX C10 Max SoC is built on TSMC’s advanced 3-nm process. It features an All Big Core design with an octa-core CPU, 11-core GPU, and MediaTek’s 8th-generation NPU, targeting high performance for multitasking, productivity, entertainment, and intelligent assistance. Compared to alternative platforms, the CPU offers up to 15% faster performance (multi-thread) and up to 50% less power (single-thread), according to MediaTek tests.

Lynred has introduced the CAPT640, a thermal imaging sensor designed specifically for automotive applications and advanced driver-assistance systems (ADAS). The company describes the device as Europe’s first thermal imaging sensor developed for the automotive industry. Lynred will present the technology at AutoSens Barcelona, September 22–24, 2026. The CAPT640 is designed to complement conventional visible-light cameras, particularly in conditions where optical cameras perform poorly. Darkness, headlight glare, backlighting, rain, and fog can affect visible-spectrum imaging, whereas thermal imaging detects the infrared radiation naturally emitted by people, animals, and objects. This enables detection of pedestrians, cyclists, and obstacles without relying on ambient or artificial illumination.

A practical look at what a database really costs in NAND writes with different storage architectures.

Here’s a roundup of this week’s must-read articles. We'll look into the latest developments on designing SWaP-optimized compute for UAVs, MIPI Alliance's new Kinematics Working Group, 140-W USB-C chargers with GaN, and more. Don't miss the ESD September/October 2026 eBook, ready for download. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Abaco Systems Introduces VNX+ SBC The VNX382 SBC combines security, functional safety, and AI acceleration for SWaP-constrained mission-critical applications. Micron Develops Ultra-Dense 512-GB DDR5 Memory Module…

TeraSignal has introduced its Analog Wave Processor (AWP), a signal-processing architecture designed for 200G/lane interconnects in next-generation AI infrastructure. The technology targets high-speed connectivity for 1.6T and 3.2T systems, combining advanced signal processing with the low-power, low-latency characteristics of linear interconnects. Unlike conventional analog equalizers and digital signal processors (DSPs), which operate on sampled or digitized signals, AWP performs mathematical operations directly on broadband electrical waveforms. The architecture implements weighting, delay, and accumulation in the analog domain, enabling signal compensation without introducing the power and latency associated with data conversion and digital processing.

Abaco Systems has launched the VNX382, the company's first VNX+ single-board computer (SBC). The VNX+ standard, developed by VITA and the Open Group SOSA community and ratified by ANSI in 2026, extends the open-standard VPX into lower size, weight, and power (SWaP) applications. The VNX382 extends rugged embedded computing into SWaP-constrained applications without tradeoffs in functional safety, security or edge processing, according to the company. The SBC is suited for tactical edge computing, secure communications, autonomous systems, flight control, UAS/UAV payloads, electronic warfare, ISR, rugged displays, and sensor fusion, deployable in uncrewed vehicles and portable or wearable platforms.

Micron Technology Inc. has demonstrated a 512-GB DDR5 Registered DIMM (RDIMM) across multiple server platforms, targeting the growing memory requirements of AI, data analytics, in-memory databases, and other data-intensive workloads. Claiming the industry's first 512-GB DDR5 module, the company says the module can reach speeds of up to 9,200 MT/s, while reducing operating power by more than 60% compared with a configuration using four 128-GB DDR5 RDIMMs. Micron’s advanced vertical interconnect packaging technology enables the high capacity by stacking multiple DRAM dies within individual packages and connecting them with through-silicon vias (TSVs).

The new working group will develop a specification to standardize the streaming format for radar and LiDAR sensor data.

Tektronix Inc. has introduced the EA-ELR 21000 Dynamic Test System, a high-dynamic, auto-ranging electronic load platform designed to validate the ±400-V and 800-V DC power architectures emerging in AI data centers. The system combines rapid load emulation with a fully regenerative architecture, allowing it to return absorbed test energy to the grid rather than dissipate it as heat. The platform centers on the EA-ELR 21000-80 4U HS, a 30-kW regenerative electronic load module rated for up to 1,000 V and 80 A. The additional voltage headroom lets engineers test 800-VDC power systems while reproducing the fast load transitions of increasingly dynamic…

The Dimensity 9600 Pro smartphone SoC reduces multi-core power consumption by 61%.

Embedded engineers designing military and aerospace systems traditionally have built hardware devices and systems around the need for ruggedness and military-grade components to ensure operation in harsh environments while meeting size, weight, and power (SWaP) budgets. As mission-critical systems from electronic warfare equipment to military drones become more intelligent and complex, designers face challenges around the need for more compute capability, modular design, secure connectivity, and software-driven functionality. In the ESD September/October 2026 eBook, we look at how embedded system design for aerospace and defense is changing to meet new autonomous and edge AI requirements.

Eggtronic has introduced a 140-W USB-C Power Delivery AC/DC reference platform for premium laptops and other high-performance USB-C-powered equipment. The design combines Eggtronic’s EPIC digital power architecture with Renesas Electronic Corp.'s high-voltage GaN technology to target high efficiency, reduced component count, and competitive system cost. The reference design uses Renesas’ TP70H150G4LSG, a 700-V GaN transistor with a typical on-resistance of 150 mΩ, together with Eggtronic’s EPIC combo controller. The resulting architecture is designed to achieve conversion efficiency approaching 96% while maintaining a bill of materials comparable to that of a conventional quasi-resonant (QR) flyback converter.

The embedded architecture of unmanned aerial vehicles (UAVs) is changing as more intelligence moves from the remote operator onto the aircraft itself. In a conventional, first-person-view drone, a human analyzes the video feed, determines where the aircraft should go, and makes many of the decisions required to complete the mission. But the architecture depends on reliable radio communications. When RF links are disrupted or GPS becomes unavailable, the aerial vehicle must perform navigation, perception, and other time-sensitive functions locally. This transition changes the computational requirement. Visual navigation, object detection, tracking, and other perception workloads need to continuously process high-bandwidth camera data alongside lower-level flight and navigation functions.

Here’s a roundup of this week’s must-read articles. We'll look into the latest developments on processors for mission-critical systems, chiplet-based FPGAs for space applications, scalable physical AI solutions, and more. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Neura Robotics and Seco Partner to Scale Physical AI The partnership combines distributed AI computing, robotics, and European manufacturing to develop scalable physical AI solutions for industry. Microchip, Marelli Target Software-Defined Vehicle Display Systems The joint demonstrator uses ASA Motion Link to stream secure, high-speed graphics and video from centralized computing systems to vehicle displays.

Renesas Electronics Corp. has expanded its RZ/G Series with two new 64-bit general-purpose microprocessors (MPUs) for human machine interface (HMI) and IoT edge systems. The pin-compatible RZ/G3L and RZ/G3SE MPUs target a range of industrial and consumer HMI and IoT gateway systems as well as home gateways that need high processing performance and high-speed network connectivity. The RZ/G3L integrates a graphics processing unit (GPU) for 3D graphics rendering together with an H.264 video codec, making the MPUs suited for smart retail terminals and medical HMI devices. The RZ/G3SE targets IoT…

Alif Semiconductor has introduced a new family of low-cost StartKit evaluation boards designed to simplify development with its edge AI-enabled Ensemble and Balletto microcontroller (MCU) platforms. The SK-E1C targets the Ensemble family, while the SK-B1 targets the Bluetooth Low Energy (BLE)-enabled Balletto devices. Both boards are priced at an MSRP of $49, providing developers with an accessible platform for evaluating on-device AI/ML processing. The StartKit boards are based on the respective MCU family’s superset configuration, combining processing, memory, and connectivity resources in a compact development platform. The architecture is centered on a 160-MHz Arm Cortex-M55 CPU with the Helium vector processing extension, which accelerates DSP-oriented workloads and supports efficient signal-processing operations.

Field-programmable gate array (FPGA) architectures for space must reconcile computing capacity, reliability, power consumption, and component availability for very long missions. A chiplet-based approach can separate processing and I/O, allowing for the optimization of radiation tolerance, performance, and upgradeability. Beyond the monolithic FPGA Space applications require increasingly higher processing capacities, especially in payloads dedicated to Earth observation, scientific data processing, and high-speed communication systems. The FPGA continues to be considered a particularly interesting platform because it allows developers to implement parallel pipelines, hardware accelerators, and reconfigurable interfaces without resorting to a dedicated application-specific IC.

Morse Micro has introduced a range of Wi-Fi HaLow USB network adapters that give computers, laptops, and access points direct connectivity to Wi-Fi HaLow networks. Available in both USB-A and USB-C formats, the adapters give developers and device manufacturers a practical way to evaluate and integrate long-range wireless technology across multiple host platforms. The adapters are based on Morse Micro’s MM8108 Wi-Fi HaLow chipset and follow the company’s existing USB network adapter reference design. The MM8108-EKH19 evaluation kit features the same architecture, giving developers an established hardware platform for Wi-Fi HaLow integration.

Neura Robotics and Seco S.p.A. have announced a strategic partnership to industrialize and scale physical AI in Europe. The collaboration combines Neura’s cognitive robotics architecture with Seco’s embedded computing and manufacturing expertise, while leveraging Qualcomm Technologies’ advanced edge-computing platforms. Initial activities will focus on electronic compute modules for Neura’s cognitive robots, including the humanoid 4NE1, to support scalable series production in Europe. At the core of Neura’s approach is a decentralized “Brain + Nervous System” architecture in which sensing and computing resources are distributed throughout the robot. Its Smart Limb concept places intelligence closer to joints, sensors, and points of physical interaction, reducing the distance between perception, computation, and real-time control.

Applications in aerospace and defense as well as heavy industry and energy place long-term reliability requirements that go far beyond the specifications of commercial electronics. The presence of ionizing radiation and extreme temperatures profoundly influences the choice between microcontrollers (MCUs), field-programmable gate arrays (FPGAs), and system-on-chips (SoCs). When the environment becomes the main design constraint The design of embedded systems for extreme environments is one of the most complex issues in electronic engineering. Unlike conventional consumer or industrial applications, in which performance, power consumption, and cost are the main design parameters, in critical systems (such as those intended for space, aviation, and military systems), the dominant factor becomes the survival of electronics itself.

Microchip Technology and Marelli have demonstrated a display connectivity solution that streams graphics and video generated by a vehicle’s centralized computing system directly to automotive displays using ASA Motion Link (ASA-ML). Based on the open automotive video connectivity and SerDes standard defined by the Automotive SerDes Alliance (ASA), the solution is designed to simplify display architectures, provide greater sourcing flexibility, and support the development of software-defined vehicles (SDVs). ASA Motion Link provides a standardized approach to high-speed video and graphics transmission across components from different technology providers. The open specification is intended to improve interoperability within the…

Here’s a roundup of this week’s must-read articles. We'll look into the latest developments on NXP MCX A5 MCUs, edge AI for military drones, modular computing for aerospace platforms, and more. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS SomDevices, Celus Bring μSMARC Modules to Design Platform The integration partnership includes seven modules based on NXP i.MX processors, provided as reusable modular building blocks for embedded system design. IAR Adds Native Linux Support to Cross-Platform Embedded IDE…

Everspin Technologies and Teledyne HiRel Semiconductors have announced a strategic partnership to expand the use of magnetoresistive random-access memory (MRAM) in aerospace, defense, and other mission-critical applications. The collaboration will initially focus on Everspin’s 256-Mb PERSYST spin-transfer torque MRAM (STT-MRAM), combining RAM-like access performance with non-volatile data retention. Under the agreement, Teledyne HiRel will offer the 256-Mb PERSYST device as part of its memory portfolio for military and aerospace customers. Target applications include avionics, VPX and single-board computer platforms, radar and electronic warfare systems, satellite electronics, autonomous systems, and other advanced electronic platforms.

Seven NXP i.MX-based modules will become reusable CUBOs, helping engineers evaluate interfaces and implementation requirements earlier.

The MCX A5 MCUs combine 10BASE-T1S Ethernet, topology discovery, and post-quantum security to extend Ethernet deeper into industrial networks.

Global defense spending has increased amidst rising geopolitical tensions and de-globalization to strengthen national security. The Trump administration’s hefty defense budget request this June allocates $2.4 billion just to drones. Resulting from this paradigm shift in warfare, global spending also follows this trend. Further fueled by technological advances, it has converged into a boon for drone companies globally. The global drone industry is expected to reach $33 billion by 2030, according to Global X ETF. Russian aggression in Ukraine so far has not only featured extensive unmanned-aerial-system warfare but also anti-drone systems that effectively jam GPS and other communication channels, according to the…

IAR has expanded the cross-platform capabilities of its certified embedded development environment by adding native Linux support alongside Windows. Developed using the Qt Framework, the new IAR cross-platform IDE is designed to provide a development environment across operating systems for safety- and compliance-critical embedded software projects. The platform also integrates directly with Visual Studio Code (VS Code) and its extension ecosystem. The move addresses a growing shift toward standardized and automated software development workflows. Many embedded engineering organizations now use Linux-based environments for continuous integration (CI) and automated builds, while developers traditionally rely on Windows-based workstations.

Achronix Semiconductor Corp. has introduced a high-performance JESD204C IP core for its family of Speedster7t FPGAs. The IP core is designed to connect advanced analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) to programmable logic. Each core supports data rates of up to 32 Gbits/s per lane and up to eight lanes per link, which translates into an aggregate serial line rate of up to 256 Gbits/s. The Achronix JESD204C IP core maintains full backward compatibility with JESD204B, while increasing lane rates and payload efficiency and improving link robustness. It enables Speedster7t FPGAs to interface with very high-speed JESD204B and JESD204C converters from leading suppliers, including Analog Devices Inc.

SensiBel has introduced the SBM140B, an optical MEMS microphone designed to provide high-fidelity audio capture across a wide acoustic range. The company claims it is the first MEMS microphone to combine an 84-dBA signal-to-noise ratio (SNR) with a 146-dB sound pressure level (SPL) acoustic overload point (AOP), resulting in a specified dynamic range of 136 dB. A 24-bit digital output supports high-resolution audio acquisition for applications requiring precise signal reproduction. The SBM140B is based on sensiBel’s optical MEMS architecture, which measures the displacement of the microphone membrane in response to acoustic signals.

Avionic systems are expected to operate for decades. But the processors inside them have much shorter lifecycles. This creates an expensive problem for avionics engineers because replacing the processor may also force changes to the surrounding computing hardware and software. For instance, advanced drones and autonomous aerial systems need more computing power for perception, sensor fusion, mission planning, and AI inference. Traditional avionics programs primarily need modularity to manage long service lives, while drones need it to keep up with faster changes in AI, software, and cybersecurity. A computer-on-module (COM) separates this fast-changing compute layer from the longer-lived system design in which the processor, memory, and core interfaces sit in a replaceable module, and the carrier board integrates the application-specific I/O, power circuitry, and external connectors.

Here’s a roundup of this week’s must-read articles. We cover the latest developments on why embedded teams require runtime observability, sensor fusion for drones, and embedded systems design for aerospace and defense. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS RAIN Alliance Launches RFID Sensor Working Group The new group will address technical and commercial barriers while promoting sensor-based RFID for traceability, maintenance, and lifecycle data. Altera Expands Agilex 9 Direct RF FPGA Ecosystem for Defense…

Seco has announced the SOM-SMARC-Dragonwing-IQ8, a SMARC Rel. 2.1.1 system-on-module (SOM) designed to help OEMs transition from Arduino-based prototyping to production-oriented industrial edge AI systems. Early hardware samples are available to select customers and partners for evaluation of AI-enabled robotics, smart machines, industrial vision, human-machine interfaces (HMIs), and machine-control applications. The module is based on the Qualcomm Dragonwing IQ8 Series and is part of Seco’s collaboration with Arduino and Qualcomm Technologies. It is intended to provide continuity between development on the Arduino VENTUNO Q edge AI platform and deployment on industrial-grade embedded hardware.

For years, electronics for military and aerospace applications have been built around hardware that could tolerate harsh environments far beyond those encountered by commercial and industrial machinery. Such systems include satellites, planetary rovers, combat vehicles, naval platforms, avionics, and electronic warfare equipment. Ruggedized packaging, military-grade components, and rigorous qualification testing ensured that systems remained operational in the face of continuous vibration, mechanical shock, electromagnetic interference, temperature extremes, and exposure to energetic particles. These environmental stresses originate from sources such as aircraft propulsion, helicopter rotors, tracked military vehicles, missile launches, and solar particle events and cosmic radiation.