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ASML, TSMC, and imec Achieve 300 mm Integration of 2D-Material Transistors with 50 nm Pitch
This week, at the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, in partnership with the lithography solution provider ASML, and semiconductor foundry TSMC, presents a novel, robust and scalable 300 ...