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EE Times | Electronic Engineering Times

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EE Times | Electronic Engineering Times @eetimes.bsky.social · 09/09/2026
Bridging the HPC Software Gap for Practical Quantum Computing HPC centers must address the infrastructure bottleneck to integrate quantum systems and unlock their full potential.... www.eetimes.com/bridging-the-hpc-so…
eetimes.com
Bridging the HPC Software Gap for Practical Quantum Computing
HPC centers must address the infrastructure bottleneck to integrate quantum systems and unlock their full potential.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 09/09/2026
BIWIN Brings Storage Solutions for AI Era at embedded world NA 2026 Visit BIWIN at Booth #6104 during embedded world NA 2026 to explore eSSDs, embedded memory, and industrial storage built for cloud and… www.eetimes.com/biwin-brings-storag…
eetimes.com
BIWIN Brings Storage Solutions for AI Era at embedded world NA 2026
Visit BIWIN at Booth #6104 during embedded world NA 2026 to explore eSSDs, embedded memory, and industrial storage built for cloud and edge applications.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 09/09/2026
The Hardware-assisted Verification Imperative Read why today’s IC system projects for applications like AI and superscalar acceleration require the most comprehensive HAV solutions and methodologies.... www.eetimes.com/the-hardware-assist…
eetimes.com
The Hardware-assisted Verification Imperative
Read why today’s IC system projects for applications like AI and superscalar acceleration require the most comprehensive HAV solutions and methodologies.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 09/09/2026
Quantum Scaling Is Becoming a Control-Electronics Problem Too many wires, too much heat, and too much latency are forcing quantum control electronics deeper into the cold.... www.eetimes.com/quantum-scaling-is-…
eetimes.com
Quantum Scaling Is Becoming a Control-Electronics Problem
Too many wires, too much heat, and too much latency are forcing quantum control electronics deeper into the cold.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 08/09/2026
Strategy Paper Urges Canada to Add Semiconductors to AI Strategy Canada’s sovereign AI ambitions will fall short unless procurement, talent, funding, and existing semiconductor strengths are aligned behind… www.eetimes.com/strategy-paper-urge…
eetimes.com
Strategy Paper Urges Canada to Add Semiconductors to AI Strategy
Canada’s sovereign AI ambitions will fall short unless procurement, talent, funding, and existing semiconductor strengths are aligned behind domestic hardware capability.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 08/09/2026
The Pragmatic Path to Achieving CRA Compliance and Securing Your Access to the EU Market As the EU Cyber Resilience Act (CRA) approaches, IoT manufacturers face stringent cybersecurity requirements across the entire product lifecycle. MediaTek, together with our strategic partners, invites you to…
eetimes.com
The Pragmatic Path to Achieving CRA Compliance and Securing Your Access to the EU Market
As the EU Cyber Resilience Act (CRA) approaches, IoT manufacturers face stringent cybersecurity requirements across the entire product lifecycle. MediaTek, together with our strategic partners, invites you to this exclusive webinar to explore how the CRA reshapes the IoT landscape and gain actionable insights—from secure hardware design to long-term lifecycle management.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 08/09/2026
The Security AI That Learns the Language of Movement UNC Charlotte researchers use edge AI to learn normal motion, predict what comes next, and flag anomalies for human review.... www.eetimes.com/the-security-ai-tha…
eetimes.com
The Security AI That Learns the Language of Movement
UNC Charlotte researchers use edge AI to learn normal motion, predict what comes next, and flag anomalies for human review.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 08/09/2026
Powering High Precision Lasers Today, no one can imagine life without the vast number of laser applications, ranging from milliwatt-class lasers to high-power processing.... www.eetimes.com/powering-high-preci…
eetimes.com
Powering High Precision Lasers
Today, no one can imagine life without the vast number of laser applications, ranging from milliwatt-class lasers to high-power processing.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 08/09/2026
How Much Impact Will AI Have on IoT Software Engineering? In theory, AI is a surefire way to raise productivity in software engineering, but the reality may not be quite so cut-and-dried.... www.eetimes.com/how-much-impact-wil…
eetimes.com
How Much Impact Will AI Have on IoT Software Engineering?
In theory, AI is a surefire way to raise productivity in software engineering, but the reality may not be quite so cut-and-dried.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 07/09/2026
Nvidia Acquires HuggingFace for $12.9B The open-source model hub will be acquired by the world’s biggest compute provider.... www.eetimes.com/nvidia-acquires-hug…
eetimes.com
Nvidia Acquires HuggingFace for $12.9B
The open-source model hub will be acquired by the world’s biggest compute provider.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 07/09/2026
Why Microcooling Will Be a Critical Enabler of Agentic AI Agentic AI won’t thrive on raw compute alone; tiny devices need microcooling to beat heat and sustain intelligence.... www.eetimes.com/why-microcooling-wi…
eetimes.com
Why Microcooling Will Be a Critical Enabler of Agentic AI
Agentic AI won’t thrive on raw compute alone; tiny devices need microcooling to beat heat and sustain intelligence.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 07/09/2026
Why Holistic Digital Twins are Needed to Accelerate SDV Development Discover how holistic digital twins help automakers shift left, overcome integration complexity and accelerate modern software-defined… www.eetimes.com/why-holistic-digita…
eetimes.com
Why Holistic Digital Twins are Needed to Accelerate SDV Development
Discover how holistic digital twins help automakers shift left, overcome integration complexity and accelerate modern software-defined vehicle development.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 07/09/2026
Kioxia’s Flash-for-DRAM Initiative Eyes AI Workloads The CXL-attached memory expansion uses NAND flash optimized for high-speed processing alongside AI compute devices.... www.eetimes.com/kioxias-flash-for-d…
eetimes.com
Kioxia’s Flash-for-DRAM Initiative Eyes AI Workloads
The CXL-attached memory expansion uses NAND flash optimized for high-speed processing alongside AI compute devices.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 04/09/2026
EE Times Magazine – September 2026 The September 2026 edition of EE Times Magazine examines how smarter buildings combine ambient energy harvesting, sensing, AI, and connected systems to improve safety while protecting privacy.... www.eetimes.com/ee-times-magazine-s…
eetimes.com
EE Times Magazine – September 2026
The September 2026 edition of EE Times Magazine examines how smarter buildings combine ambient energy harvesting, sensing, AI, and connected systems to improve safety while protecting privacy.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 04/09/2026
When the Package Becomes an Electrical Design Variable AI power integrity now lives inside the package, not just the PCB. Treat chip, package, and board as one PDN.... www.eetimes.com/when-the-package-be…
eetimes.com
When the Package Becomes an Electrical Design Variable
AI power integrity now lives inside the package, not just the PCB. Treat chip, package, and board as one PDN.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 03/09/2026
7 Steps to Take Now: Meet the EU CRA 9/11/26 Reporting Deadline  Prepare for the EU Cyber Resilience Act's September 2026 reporting deadline; follow these seven steps to ensure compliance and readiness.... www.eetimes.com/7-steps-to-take-now…
eetimes.com
7 Steps to Take Now: Meet the EU CRA 9/11/26 Reporting Deadline 
Prepare for the EU Cyber Resilience Act's September 2026 reporting deadline; follow these seven steps to ensure compliance and readiness.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 03/09/2026
TechWorks Aligns U.K. Semiconductors Under UKSIA Umbrella TechWorks corrals U.K. chip groups under UKSIA as funding surges 65% and 700 execs swarm London.... www.eetimes.com/techworks-aligns-u-…
eetimes.com
TechWorks Aligns U.K. Semiconductors Under UKSIA Umbrella
TechWorks corrals U.K. chip groups under UKSIA as funding surges 65% and 700 execs swarm London.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 03/09/2026
Display Developments Challenge Controllers Discover how AMOLED, micro-OLED and advanced DDIC technologies are transforming displays with higher resolution, lower power and immersive experiences.... www.eetimes.com/display-development…
eetimes.com
Display Developments Challenge Controllers
Discover how AMOLED, micro-OLED and advanced DDIC technologies are transforming displays with higher resolution, lower power and immersive experiences.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 03/09/2026
India’s Quantum Journey Goes Beyond the Qubit IBM’s Amaravati deployment could accelerate India’s quantum ecosystem as startups develop processors, software, and supporting technologies.... www.eetimes.com/indias-quantum-jour…
eetimes.com
India’s Quantum Journey Goes Beyond the Qubit
IBM’s Amaravati deployment could accelerate India’s quantum ecosystem as startups develop processors, software, and supporting technologies.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 02/09/2026
Mercedes Spinout Athos Closes Its Doors The startup was unable to secure the financing required to continue commercialising its chiplet-based technology... www.eetimes.com/mercedes-spinout-at…
eetimes.com
Mercedes Spinout Athos Closes Its Doors
The startup was unable to secure the financing required to continue commercialising its chiplet-based technology
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 02/09/2026
Secure Safety & Security Communications: Cut Time, Complexity, and Install Cost Date: September 30, 2026 or October 14, 2026 As Safety and Security systems become increasingly connected, system designers face growing demands for improved diagnostics, simplified installation, and future-proofing…
eetimes.com
Secure Safety & Security Communications: Cut Time, Complexity, and Install Cost
Date: September 30, 2026 or October 14, 2026 As Safety and Security systems become increasingly connected, system designers face growing demands for improved diagnostics, simplified installation, and future-proofing network architectures. Join this webinar, where we will demonstrate how to enable next-generation security and building safety networks while reducing wiring complexity, improving fault detection, supporting intelligent edge monitoring, and building scalable communication infrastructures for modern safety and security systems. Attendees will gain insight into: Connecting surveillance, access controls, and security systems across multiple rooms and buildings with enough communication bandwidth…
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 02/09/2026
Astella Joins 5G-ACIA Shanghai to Advance Industrial 5G and IIoT Innovation  Astella announces its participation in the 5G-ACIA Industrial 5G Day in Shanghai, a dedicated industry event focused on Industrial 5G....
eetimes.com
Astella Joins 5G-ACIA Shanghai to Advance Industrial 5G and IIoT Innovation 
Astella announces its participation in the 5G-ACIA Industrial 5G Day in Shanghai, a dedicated industry event focused on Industrial 5G.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 02/09/2026
Manufacturing Growth Slows in August Amid Supply and Cost Strains U.S. manufacturing growth continued for the eighth consecutive month in August, though momentum slowed due to supply chain and cost… www.eetimes.com/manufacturing-growt…
eetimes.com
Manufacturing Growth Slows in August Amid Supply and Cost Strains
U.S. manufacturing growth continued for the eighth consecutive month in August, though momentum slowed due to supply chain and cost pressures.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 02/09/2026
Indian Startup HrdWyr Builds AI-Native SoCs for the Physical World HrdWyr is developing AI-native SoCs for power management, motor control, and other applications where AI meets physical systems.... www.eetimes.com/indian-startup-hrdw…
eetimes.com
Indian Startup HrdWyr Builds AI-Native SoCs for the Physical World
HrdWyr is developing AI-native SoCs for power management, motor control, and other applications where AI meets physical systems.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 02/09/2026
From Silos to Systems, from Data to Insight: Unlocking Organizational Knowledge and Winning in the AI Era with Keysight SOS Enterprise The white paper introduces Keysight SOS Enterprise as an AI-ready engineering data and IP… www.eetimes.com/from-silos-to-syste…
eetimes.com
From Silos to Systems, from Data to Insight: Unlocking Organizational Knowledge and Winning in the AI Era with Keysight SOS Enterprise
The white paper introduces Keysight SOS Enterprise as an AI-ready engineering data and IP management platform designed to help semiconductor and electronics companies centrally manage, govern, and secure design data across global teams. It provides version control, IP traceability, role-based access, and audit-ready governance to ensure design integrity, improve reuse, reduce risk, and enable advanced analytics and AI-driven engineering workflows. Download Now
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
Exclusive: Sir Robin Saxby Reflects on Impact of AI, Geopolitics, and Retirement An EE Times exclusive video interview with Sir Robin Saxby, founding CEO of Arm, on industry transformation in… www.eetimes.com/exclusive-sir-robin…
eetimes.com
Exclusive: Sir Robin Saxby Reflects on Impact of AI, Geopolitics, and Retirement
An EE Times exclusive video interview with Sir Robin Saxby, founding CEO of Arm, on industry transformation in the age of AI, geopolitics, and how retirement has allowed him to support new startups.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
How AI Is Reshaping the Global Semiconductor Patent Landscape AI is turning chip patents into a geopolitical battle for dominance, from Nvidia’s CUDA moat to China’s filing surge.... www.eetimes.com/how-ai-is-reshaping…
eetimes.com
How AI Is Reshaping the Global Semiconductor Patent Landscape
AI is turning chip patents into a geopolitical battle for dominance, from Nvidia’s CUDA moat to China’s filing surge.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
Opportunity Charging Enabled by Fast Charging MultiVoltage Batteries While opportunity charging is a practice applicable to both Lead Acidand Lithium-ion (Li-ion) batteries for motive power systems, fast… www.eetimes.com/opportunity-chargin…
eetimes.com
Opportunity Charging Enabled by Fast Charging MultiVoltage Batteries
While opportunity charging is a practice applicable to both Lead Acidand Lithium-ion (Li-ion) batteries for motive power systems, fast charging is a key differentiator for Lithium-ion batteries. Because the chemistry allows fast charging without damaging cycle life, Li-ion multivoltge batteries can be charged opportunistically during breaks and don’t require battery swaps. Learn about best practices for opportunity charging, and the benefits of multivoltage batteries that can charge at double their output and cut charge time in half. Download Now
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
The Future of Cable Testing: Why Intelligent Automation is Replacing Manual Validation This whitepaper examines the limitations of manual cable validation processes and explores how automated testing strategies help address common engineering and manufacturing pain points....
eetimes.com
The Future of Cable Testing: Why Intelligent Automation is Replacing Manual Validation
This whitepaper examines the limitations of manual cable validation processes and explores how automated testing strategies help address common engineering and manufacturing pain points. Topics include improving test repeatability, reducing operator-dependent variability, minimizing setup time, streamlining documentation, and enhancing production scalability. The paper also reviews the role of intelligent switching, automated test sequencing, digital recordkeeping, and guided workflows in creating more efficient and data-driven test environments. Readers will gain practical insights into modern approaches that improve product quality, simplify compliance efforts, and support the growing demands of advanced cable and harness manufacturing. Download Now
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
The Link Budget Is Decided at the Connector Scale-up optics will be decided by the link budget. The largest recoverable losses sit at the connector and inside the silicon photonics platform.... www.eetimes.com/the-link-budget-is-…
eetimes.com
The Link Budget Is Decided at the Connector
Scale-up optics will be decided by the link budget. The largest recoverable losses sit at the connector and inside the silicon photonics platform.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
Monitoring PV Efficiency & Fault Detection Solar PV installations rely on ongoing monitoring to maintain energy yield, uptime and safe operation throughout their working life.... www.eetimes.com/monitoring-pv-effic…
eetimes.com
Monitoring PV Efficiency & Fault Detection
Solar PV installations rely on ongoing monitoring to maintain energy yield, uptime and safe operation throughout their working life. This application guide explains how insulation degradation can create leakage paths between the PV circuit and earth, how insulation resistance (RISO) measurements can help identify developing faults, and why readings should be assessed in the context of system voltage, inverter design and environmental conditions. It also shows how high-voltage reed relays can be used to temporarily connect current-sensing circuits to the positive and negative sides of a PV array for ground-fault and insulation monitoring.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
From Silos to Systems, from Data to Insight : Unlocking Organizational Knowledge and Winning in the AI Era with Keysight SOS Enterprise The… www.eetimes.com/from-silos-to-syste…
eetimes.com
From Silos to Systems, from Data to Insight : Unlocking Organizational Knowledge and Winning in the AI Era with Keysight SOS Enterprise
The white paper introduces Keysight SOS Enterprise as an AI-ready engineering data and IP management platform designed to help semiconductor and electronics companies centrally manage, govern, and secure design data across global teams. It provides version control, IP traceability, role-based access, and audit-ready governance to ensure design integrity, improve reuse, reduce risk, and enable advanced analytics and AI-driven engineering workflows. Download Now
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
Solid-State Relays for Thermostat Design Mechanical relay vs. solid-state relay for thermostat design: compare lifespan, switching speed, power loss, EMI, and PCB space using the MP9566.... www.eetimes.com/solid-state-relays-…
eetimes.com
Solid-State Relays for Thermostat Design
Mechanical relay vs. solid-state relay for thermostat design: compare lifespan, switching speed, power loss, EMI, and PCB space using the MP9566.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
IC Components: A Professional Sourcing Platform with Over 20 Years of Experience IC Components offers global electronic component sourcing, broad product coverage, technical support,… www.eetimes.com/ic-components-a-pro…
eetimes.com
IC Components: A Professional Sourcing Platform with Over 20 Years of Experience
IC Components offers global electronic component sourcing, broad product coverage, technical support, alternative parts, verification, and delivery services.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
Inside Rochester Electronics’ TLS360™ Program  For engineers working on long-lifecycle systems such as aerospace and defense platforms, industrial controls, medical devices, and transportation infrastructure, obsolescence is a… www.eetimes.com/inside-rochester-el…
eetimes.com
Inside Rochester Electronics’ TLS360™ Program 
For engineers working on long-lifecycle systems such as aerospace and defense platforms, industrial controls, medical devices, and transportation infrastructure, obsolescence is a recurring, costly certainty. A part that is active today can be flagged for discontinuation years before the system it powers is scheduled to retire, forcing a familiar, expensive choice: redesign around a new component or rush to secure enough inventory to bridge the gap.  Rochester Electronics is combating obsolescence with Through Life Support 360 (TLS360™), our program-level lifecycle assurance offering for select mission-critical semiconductor product families. …
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
Product Configuration Guide for Electronics Manufacturers Product configuration makes it possible for electronics manufacturers to offer different product variants without engineering every order from scratch.... www.eetimes.com/product-configurati…
eetimes.com
Product Configuration Guide for Electronics Manufacturers
Product configuration makes it possible for electronics manufacturers to offer different product variants without engineering every order from scratch.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
SK Hynix’s $4B HBM Project Targets U.S. Chipmaking Gap SK Hynix’s $4B Indiana HBM plant aims to plug America’s AI chip packaging hole and build a Purdue-backed supply chain by 2029.... www.eetimes.com/sk-hynixs-4b-hbm-pr…
eetimes.com
SK Hynix’s $4B HBM Project Targets U.S. Chipmaking Gap
SK Hynix’s $4B Indiana HBM plant aims to plug America’s AI chip packaging hole and build a Purdue-backed supply chain by 2029.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 01/09/2026
Automotive Software Defined Vehicle (SDV) Architectures Join this presentation where our expert will highlight how modern vehicles are evolving into software-centric platforms that can be continuously updated,… www.eetimes.com/automotive-software…
eetimes.com
Automotive Software Defined Vehicle (SDV) Architectures
Join this presentation where our expert will highlight how modern vehicles are evolving into software-centric platforms that can be continuously updated, enhanced, and monetized throughout their lifecycle.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 31/08/2026
SUSE Positions Hardware Choice as a Core Part of Sovereign AI SUSE says enterprises need the flexibility to change AI hardware without rebuilding their infrastructure.... www.eetimes.com/suse-positions-hard…
eetimes.com
SUSE Positions Hardware Choice as a Core Part of Sovereign AI
SUSE says enterprises need the flexibility to change AI hardware without rebuilding their infrastructure.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 31/08/2026
When Off-The-Shelf Isn’t Enough Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling equipment must deliver greater performance, reliability and consistency while supporting… www.eetimes.com/when-off-the-shelf-…
eetimes.com
When Off-The-Shelf Isn’t Enough
Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling equipment must deliver greater performance, reliability and consistency while supporting demanding production requirements. This case study provides engineers with practical insight into addressing high-current connectivity challenges within data centre cooling applications. It examines how manual processes and assembly of high-current connections created production bottlenecks, inconsistencies and rework, and how a collaborative engineering approach was used to develop a solution better suited to the manufacturing process. The case study follows the journey from defining technical requirements and developing prototypes through to validation, testing and production.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 31/08/2026
Advanced Cooling Technologies Address the Automotive Heat Challenge New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat fluxes… www.eetimes.com/advanced-cooling-te…
eetimes.com
Advanced Cooling Technologies Address the Automotive Heat Challenge
New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat fluxes higher.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 28/08/2026
Google’s Marvell Deal Shows Custom Silicon Spreading Beyond the TPU Google’s expanded relationship with Marvell suggests that memory, networking, storage, and data movement are candidates for… www.eetimes.com/googles-marvell-dea…
eetimes.com
Google’s Marvell Deal Shows Custom Silicon Spreading Beyond the TPU
Google’s expanded relationship with Marvell suggests that memory, networking, storage, and data movement are candidates for specialization too.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 28/08/2026
Microscale Power Management Starts with Microflow Heat Measurement Laser pulses and X-ray imaging reveal the surprising impact of micron-scale material defects on heat dissipation.... www.eetimes.com/microscale-power-ma…
eetimes.com
Microscale Power Management Starts with Microflow Heat Measurement
Laser pulses and X-ray imaging reveal the surprising impact of micron-scale material defects on heat dissipation.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 27/08/2026
First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC At Hot Chips 2026, Richard Ho, says OpenAI isn't just repurposing a GPU to suit… www.eetimes.com/first-benchmarks-re…
eetimes.com
First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
At Hot Chips 2026, Richard Ho, says OpenAI isn't just repurposing a GPU to suit AI: Jalapeño is a purpose built AI accelerator built from scratch for AI workloads.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 27/08/2026
Qualcomm Bets Open-Source AI Software Can Break Nvidia’s Lock-In Modular aims to separate AI software from silicon choice, giving Qualcomm and other challengers a shot at Nvidia-dominated workloads.... www.eetimes.com/qualcomm-bets-open-…
eetimes.com
Qualcomm Bets Open-Source AI Software Can Break Nvidia’s Lock-In
Modular aims to separate AI software from silicon choice, giving Qualcomm and other challengers a shot at Nvidia-dominated workloads.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 27/08/2026
NewPower Worldwide Expands Credit Facility to $750 Million to Support Global Growth and Customer Demand NASHUA, New Hampshire – NewPower Worldwide, one of the… www.eetimes.com/newpower-worldwide-…
eetimes.com
NewPower Worldwide Expands Credit Facility to $750 Million to Support Global Growth and Customer Demand
NASHUA, New Hampshire – NewPower Worldwide, one of the electronics industry’s fastest-growing distributors, today announced it has expanded its committed credit facility to $750 million, further enhancing its ability to invest in inventory, support customer growth, and capitalize on opportunities across the global supply chain. The increase follows a period of exceptional growth for NewPower Worldwide. Since its founding in 2014, the company has rapidly expanded its global footprint, growing to 14 offices across the Americas, EMEA, and APAC, with $5 billion in annual sales, and managing more than $1 billion in inventory worldwide.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 27/08/2026
Why Connectivity Has Become an Edge AI Design Decision Edge AI isn’t smart if its wireless link chokes; design compute, security, and Wi‑Fi 7 handoffs together from day one.... www.eetimes.com/why-connectivity-ha…
eetimes.com
Why Connectivity Has Become an Edge AI Design Decision
Edge AI isn’t smart if its wireless link chokes; design compute, security, and Wi‑Fi 7 handoffs together from day one.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 26/08/2026
NVMe 2.4 Update Adds Post-Quantum Security, Power Controls NVMe 2.4 enhances security, power, virtualization, and management across cloud, AI, and enterprise workloads.... www.eetimes.com/nvme-2-4-update-add…
eetimes.com
NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
NVMe 2.4 enhances security, power, virtualization, and management across cloud, AI, and enterprise workloads.
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 26/08/2026
Reliable Power-Path Design: Integrating MOSFETs, Diodes, TVS Devices, and Capacitors Design a reliable 24V power path, pick the right MOSFET, diode, TVS, and capacitor to handle surges,… www.eetimes.com/reliable-power-path…
eetimes.com
Reliable Power-Path Design: Integrating MOSFETs, Diodes, TVS Devices, and Capacitors
Design a reliable 24V power path, pick the right MOSFET, diode, TVS, and capacitor to handle surges, reverse polarity, and inrush current
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EE Times | Electronic Engineering Times @eetimes.bsky.social · 26/08/2026
Why Automation Is Essential to Achieve EU CRA Compliance  Discover how automation streamlines product-level conformity workflows to help manufacturers achieve EU Cyber Resilience Act compliance.... www.eetimes.com/why-automation-is-e…
eetimes.com
Why Automation Is Essential to Achieve EU CRA Compliance 
Discover how automation streamlines product-level conformity workflows to help manufacturers achieve EU Cyber Resilience Act compliance.
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