HPC centers must address the infrastructure bottleneck to integrate quantum systems and unlock their full potential.

Visit BIWIN at Booth #6104 during embedded world NA 2026 to explore eSSDs, embedded memory, and industrial storage built for cloud and edge applications.

Read why today’s IC system projects for applications like AI and superscalar acceleration require the most comprehensive HAV solutions and methodologies.

Too many wires, too much heat, and too much latency are forcing quantum control electronics deeper into the cold.

Canada’s sovereign AI ambitions will fall short unless procurement, talent, funding, and existing semiconductor strengths are aligned behind domestic hardware capability.

As the EU Cyber Resilience Act (CRA) approaches, IoT manufacturers face stringent cybersecurity requirements across the entire product lifecycle. MediaTek, together with our strategic partners, invites you to this exclusive webinar to explore how the CRA reshapes the IoT landscape and gain actionable insights—from secure hardware design to long-term lifecycle management.

UNC Charlotte researchers use edge AI to learn normal motion, predict what comes next, and flag anomalies for human review.

Today, no one can imagine life without the vast number of laser applications, ranging from milliwatt-class lasers to high-power processing.

In theory, AI is a surefire way to raise productivity in software engineering, but the reality may not be quite so cut-and-dried.

The open-source model hub will be acquired by the world’s biggest compute provider.

Agentic AI won’t thrive on raw compute alone; tiny devices need microcooling to beat heat and sustain intelligence.

Discover how holistic digital twins help automakers shift left, overcome integration complexity and accelerate modern software-defined vehicle development.

The CXL-attached memory expansion uses NAND flash optimized for high-speed processing alongside AI compute devices.

The September 2026 edition of EE Times Magazine examines how smarter buildings combine ambient energy harvesting, sensing, AI, and connected systems to improve safety while protecting privacy.

AI power integrity now lives inside the package, not just the PCB. Treat chip, package, and board as one PDN.

Prepare for the EU Cyber Resilience Act's September 2026 reporting deadline; follow these seven steps to ensure compliance and readiness.

TechWorks corrals U.K. chip groups under UKSIA as funding surges 65% and 700 execs swarm London.

Discover how AMOLED, micro-OLED and advanced DDIC technologies are transforming displays with higher resolution, lower power and immersive experiences.

IBM’s Amaravati deployment could accelerate India’s quantum ecosystem as startups develop processors, software, and supporting technologies.

The startup was unable to secure the financing required to continue commercialising its chiplet-based technology

Date: September 30, 2026 or October 14, 2026 As Safety and Security systems become increasingly connected, system designers face growing demands for improved diagnostics, simplified installation, and future-proofing network architectures. Join this webinar, where we will demonstrate how to enable next-generation security and building safety networks while reducing wiring complexity, improving fault detection, supporting intelligent edge monitoring, and building scalable communication infrastructures for modern safety and security systems. Attendees will gain insight into: Connecting surveillance, access controls, and security systems across multiple rooms and buildings with enough communication bandwidth…

Astella announces its participation in the 5G-ACIA Industrial 5G Day in Shanghai, a dedicated industry event focused on Industrial 5G.

U.S. manufacturing growth continued for the eighth consecutive month in August, though momentum slowed due to supply chain and cost pressures.

HrdWyr is developing AI-native SoCs for power management, motor control, and other applications where AI meets physical systems.

The white paper introduces Keysight SOS Enterprise as an AI-ready engineering data and IP management platform designed to help semiconductor and electronics companies centrally manage, govern, and secure design data across global teams. It provides version control, IP traceability, role-based access, and audit-ready governance to ensure design integrity, improve reuse, reduce risk, and enable advanced analytics and AI-driven engineering workflows. Download Now

An EE Times exclusive video interview with Sir Robin Saxby, founding CEO of Arm, on industry transformation in the age of AI, geopolitics, and how retirement has allowed him to support new startups.

AI is turning chip patents into a geopolitical battle for dominance, from Nvidia’s CUDA moat to China’s filing surge.

While opportunity charging is a practice applicable to both Lead Acidand Lithium-ion (Li-ion) batteries for motive power systems, fast charging is a key differentiator for Lithium-ion batteries. Because the chemistry allows fast charging without damaging cycle life, Li-ion multivoltge batteries can be charged opportunistically during breaks and don’t require battery swaps. Learn about best practices for opportunity charging, and the benefits of multivoltage batteries that can charge at double their output and cut charge time in half. Download Now

This whitepaper examines the limitations of manual cable validation processes and explores how automated testing strategies help address common engineering and manufacturing pain points. Topics include improving test repeatability, reducing operator-dependent variability, minimizing setup time, streamlining documentation, and enhancing production scalability. The paper also reviews the role of intelligent switching, automated test sequencing, digital recordkeeping, and guided workflows in creating more efficient and data-driven test environments. Readers will gain practical insights into modern approaches that improve product quality, simplify compliance efforts, and support the growing demands of advanced cable and harness manufacturing. Download Now

Scale-up optics will be decided by the link budget. The largest recoverable losses sit at the connector and inside the silicon photonics platform.

Solar PV installations rely on ongoing monitoring to maintain energy yield, uptime and safe operation throughout their working life. This application guide explains how insulation degradation can create leakage paths between the PV circuit and earth, how insulation resistance (RISO) measurements can help identify developing faults, and why readings should be assessed in the context of system voltage, inverter design and environmental conditions. It also shows how high-voltage reed relays can be used to temporarily connect current-sensing circuits to the positive and negative sides of a PV array for ground-fault and insulation monitoring.

The white paper introduces Keysight SOS Enterprise as an AI-ready engineering data and IP management platform designed to help semiconductor and electronics companies centrally manage, govern, and secure design data across global teams. It provides version control, IP traceability, role-based access, and audit-ready governance to ensure design integrity, improve reuse, reduce risk, and enable advanced analytics and AI-driven engineering workflows. Download Now

Mechanical relay vs. solid-state relay for thermostat design: compare lifespan, switching speed, power loss, EMI, and PCB space using the MP9566.

IC Components offers global electronic component sourcing, broad product coverage, technical support, alternative parts, verification, and delivery services.

For engineers working on long-lifecycle systems such as aerospace and defense platforms, industrial controls, medical devices, and transportation infrastructure, obsolescence is a recurring, costly certainty. A part that is active today can be flagged for discontinuation years before the system it powers is scheduled to retire, forcing a familiar, expensive choice: redesign around a new component or rush to secure enough inventory to bridge the gap.  Rochester Electronics is combating obsolescence with Through Life Support 360 (TLS360™), our program-level lifecycle assurance offering for select mission-critical semiconductor product families. …

Product configuration makes it possible for electronics manufacturers to offer different product variants without engineering every order from scratch.

SK Hynix’s $4B Indiana HBM plant aims to plug America’s AI chip packaging hole and build a Purdue-backed supply chain by 2029.

Join this presentation where our expert will highlight how modern vehicles are evolving into software-centric platforms that can be continuously updated, enhanced, and monetized throughout their lifecycle.

SUSE says enterprises need the flexibility to change AI hardware without rebuilding their infrastructure.

Solving High-Current Connectivity Challenges in Data Centre Cooling As data centre power densities increase, cooling equipment must deliver greater performance, reliability and consistency while supporting demanding production requirements. This case study provides engineers with practical insight into addressing high-current connectivity challenges within data centre cooling applications. It examines how manual processes and assembly of high-current connections created production bottlenecks, inconsistencies and rework, and how a collaborative engineering approach was used to develop a solution better suited to the manufacturing process. The case study follows the journey from defining technical requirements and developing prototypes through to validation, testing and production.

New cooling technologies are emerging as electric drivetrains, AI processors, and autonomous systems push automotive heat fluxes higher.

Google’s expanded relationship with Marvell suggests that memory, networking, storage, and data movement are candidates for specialization too.

Laser pulses and X-ray imaging reveal the surprising impact of micron-scale material defects on heat dissipation.

At Hot Chips 2026, Richard Ho, says OpenAI isn't just repurposing a GPU to suit AI: Jalapeño is a purpose built AI accelerator built from scratch for AI workloads.

Modular aims to separate AI software from silicon choice, giving Qualcomm and other challengers a shot at Nvidia-dominated workloads.

NASHUA, New Hampshire – NewPower Worldwide, one of the electronics industry’s fastest-growing distributors, today announced it has expanded its committed credit facility to $750 million, further enhancing its ability to invest in inventory, support customer growth, and capitalize on opportunities across the global supply chain. The increase follows a period of exceptional growth for NewPower Worldwide. Since its founding in 2014, the company has rapidly expanded its global footprint, growing to 14 offices across the Americas, EMEA, and APAC, with $5 billion in annual sales, and managing more than $1 billion in inventory worldwide.

Edge AI isn’t smart if its wireless link chokes; design compute, security, and Wi‑Fi 7 handoffs together from day one.

NVMe 2.4 enhances security, power, virtualization, and management across cloud, AI, and enterprise workloads.

Design a reliable 24V power path, pick the right MOSFET, diode, TVS, and capacitor to handle surges, reverse polarity, and inrush current

Discover how automation streamlines product-level conformity workflows to help manufacturers achieve EU Cyber Resilience Act compliance.